Open MPW (Multi-Project Wafer) shuttle program, executed by eFabless and sponsored by Google, provides a unique opportunity to fabricate open-source IC (Chip) design projects. A team of researchers in Electrical Engineering Department at the University of Engineering and Technology (UET), Lahore, including Dr. Tayyab Mehmood, Dr. Muhammad Tahir, Dr. Ubaid, and Mr. Umer Shahid working on motor control IC design project “sermo-soc”, submitted their design to second round of MPW shuttle program.
The message received from Jeff DiCorpo, Senior Vice President, Business Development at eFabless, has confirmed the acceptance of the design. The design will go into fabrication in near future with the support of an industrial partner in the USA. The message received from Jeff DiCorpo, Senior Vice President, Business Development at eFabless, has confirmed the acceptance of the design. The design will go into fabrication in near future with the support of an industrial partner in the USA. “It gives us immense pleasure to announce that our faculty’s motor control Application-Specific IC (ASIC) design submitted to eFabless has been selected for fabrication,” said Dr Syed Mansoor Sarwar, Vice Chancellor of the UET. “The IC will be the first ever tapeout from UET Lahore,” he added.
Furthermore, the most prestigious professional society in electrical and electronic engineering, IEEE Solid-State Circuits Society (SSCS), has shown interest to sponsor the project. Prof. Boris Murmann of Electrical Engineering Department at Stanford University and Chair of IEEE SSCS wrote, “IEEE SSCS is interested in sponsoring your project and picking up the tape-out cost. If you are OK with this, we would like to mention your work in an announcement. There could also be opportunities to present your work at a future IEEE event as we expand our open-source activities within the IEEE SSCS. Congratulations on your impressive work and successful tape out!”
Content: UET Tribune